Packaging Eng (Mechanical) job Hillsboro Oregon


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Packaging Eng (Mechanical) Job

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Employer Name: Intel	SpiderID: 13823301
Location: Hillsboro, Oregon	Date Posted: 8/27/2024
Wage:	Category: Engineering
Job Code:

Job Description:
Intel Corporation has opening(s) in Aloha and Hillsboro, OR. Combination ed/exp accepted in some positions in lieu of degree. Telecommuting may be permitted. When not telecommuting, must report to worksite. To apply, email resume to North_jobs@intel.com and reference the job # below. Apply to each job # of interest. Applications will be accepted through 10/13/24. EOE

Packaging Eng (Mechanical)-Emphasis in working with the design standards, documentation, specifications, and life cycle of electromechanical designs in semiconductor fabrication. Design and develop product packaging and provide ongoing engineering support for integrated circuit or semiconductor assemblies. Requires BS+5 yrs exp OR MS+3 yrs exp (#9096-1); MS+6 mo exp (#9097-1); MS+3 yrs exp (#9098-1); or PhD (#9099-1).

Job Criteria:
Start Date:
Position Type: Full-Time Permanent
Years of Experience Required:
Education Required:
Overnight Travel:
Vacation Time:

Job Benefits:
Other Benefits

Contact Information:

Contact Name: Intel	Company Type: Employer
Company: Intel

City: Hillsboro
State: Oregon
Zip: 97124

Web Site: https://www.intel.com

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