Process Device Engineer - Manufacturing Resume Search
Process Device Engineer - Manufacturing Resume Search
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Process/Device Engineer Resume


Desired Industry: Manufacturing SpiderID: 3115
Desired Job Location: San Jose, California Date Posted: 7/19/2005
Type of Position: Full-Time Permanent Availability Date: 07/25/2005
Desired Wage:
U.S. Work Authorization: No
Job Level: New Grad/Entry Level Willing to Travel: Yes, More Than 75%
Highest Degree Attained: Masters Willing to Relocate: Yes


Objective:

To obtain a full time engineering position in the semiconductor industry providing an opportunity to work in process and product development, failure analysis, and yield improvement


Experience:
Engineering Coop, Hutchinson Technology Inc., Hutchinson, MN (since Sep. 2004)
* Assisting Process Engineers in conducting process experiments, failure, and data analysis
* Conducting electrical characterization of thin films, generating and analyzing data and process flow, and reporting to project managers weekly
* Responsible for coordinating with Design and Probe Engineering teams for suspension ammeblies in hard disk drives
* Improved yield of samples by 100% for polymide/copper adhesion using reverse pulse plating, ion beam preatreatments
* Worked closely with production across departments by troubleshooting process interactions

Graduate Research Assistant, University of Arkansas, High Density Electronics Center (HiDEC), Fayetteville, AR (Jan. 2002 to Aug. 2004)
* Fabricated low temperature polycrystalline silicon thin films on glass and silicon substrates
* Analyzed polySi thin films using SEM, XRD, AFM, EDX , and Raman Spectroscopy
* Supervised technicians, trained and worked closely with new graduate research assistants
* Taught and assisted several classes in Electronics and Semiconductor Devices


Education:
M.S. in Electrical Engineering, Dec 2004
University of Arkansas, Fayetteville, AR
Areas of concentration: Semiconductor Devices and Materials Processing, Wafer Fabrication
Major G.P.A. 3.6

B.S. in Electronics and Communication Engineering, March 2002
Jawaharlal Nehru Technological University, Hyderabad, AP, India
G.P.A. 3.7


Skills:
* Strong knowledge and background in semiconductor device physics, electronic properties of materials, CMOS VLSI circuit design and process flow, and silicon wafer manufacturing processes
* Extensive hands on experience in thin film deposition (PVD, ECD, and PECVD), wets chemical processing, metal induced and laser crystallization, and electrical, chemical, and surface characterization of thin films
* Good knowledge of DOE and SPC and relevant analysis tools such as Minitab, JMP, etc...
* Strong computer skills in Word, Excel, PowerPoint, UNIX, Mentor Graphics, C, C++, SPICE, PC1D, Matlab, Design Expert, and LabVIEW
* Self motivated team player with strong leadership, problem solving, and oral and written communication skills
* CLEANROOM CERTIFIED PROFESSIONAL: Certified to work in class 100 cleanroom environment on various semiconductor processing and characterization equipment


Additional Information:
* Webmaster, 2004 Components Packaging and Manufacturing Technology Society (CPMT) student chapter; Awarded the ‘Best Student Chapter of the Year 2004’.
* IEEE and MRS student member
* University of Arkansas Cricket Team Captain, August 2002 to August 2004


Candidate Contact Information:
Name: sampath paduru
Street: Phone: 4792832181
City: Hutchinson Fax:    -
State: Minnesota
Zip: 55350
Web Site:


    



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