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Reliability Technician Resume
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| Desired Industry: Laboratory Technician |
SpiderID: 17950 |
| Desired Job Location: Wichita, Kansas |
Date Posted: 12/27/2007 |
| Type of Position: Full-Time Permanent |
Availability Date: |
| Desired Wage: |
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U.S. Work Authorization: Yes |
| Job Level: Experienced with over 2 years experience |
Willing to Travel: No |
| Highest Degree Attained: High School/Equivalent |
Willing to Relocate: Yes |
Objective:
To utilize my technical skills in the areas of failure analysis, environmental analysis, or development analysis. Preferably in a quality oriented environment.
Experience:
Manpower,Inc. Tempe, AZ 2007 - Present
Website Technician - Contract Employment when needed.
Medtronic
Tempe, AZ 03/06 – 08/06
Chemical Technician
(Contract Employment)
·Conduct quantitative analysis on chemicals used in the plating department.
·Perform FT-IR on various solids, gases and liquids.
·De-process device failures by using various wet chemical techniques.
·Familiar with failure analysis equipment such as, Thermo Electron FT-IR, Dionex Chromatography, Varian CP-3800 Gas Chromatography, Perk Elmer 100 Atomic Absorption Spectrometer, Brinkman Titrino – Auto Titration, Orion Ph meter, Nisene – D Cap d2i Jet etch, Struers Accutom 50, Struers RotoPol – 35, Struers TegraPol – 35, Allied Techprep.
ON Semiconductor Phoenix, AZ 07/03 – 06/05
Method Development Technician (Contract Employment)
·Acoustic Microscopy analysis on various package types. High mixture of Analog, Discrete and Logic devices.
·Support worldwide development and characterization of new and improved products.
·Perform preventative maintenance on analytical lab equipment.
·Provide technical assistance to other group members or departments.
·Verify device failure by using various wet & dry chemical techniques.
·Conduct multiple research studies on various new chemicals, glues, and deprocessing techniques.
·Familiar with failure analysis equipment such as, B&G Decapsulation equipment, Sonix Scanning Acoustic Microscope, Sonoscan D6000, X-ray Fein Focus, UTI A2R4 electrical tester, Buehler cross-sectioning equipment, Oscilloscopes, and hermeticity testing.
·Supplied product and reliability engineering with failure analysis reports utilizing csam, sem, and cross section images.
Amkor Technology Chandler, AZ 05/00 – 06/02
Reliability Lab Specialist
·Characterize various packaging prototypes. High mixture of Flip Chip packaging included various underfills, epoxy compounds, die sizes, substrate and mold body sizes.
·Perform reliability testing of Flip Chip BGA packaging, Opto, and Mems devices. Qualification included level 1 and level 2 MRT, PCT, TC, HTS, and 85/85 RH.
·Established quality standards for reliability process.
·Provide worldwide support to product development engineers in the development and characterization of new products. Perform preventative maintenance on all lab equipment.
·Perform failure analysis using various techniques to verify failure mode.
·Perform preventative maintenance on various lab equipment.
·Familiar with failure analysis and reliability lab equipment such as Thermotron Temperature Cycling Chamber, ESPEC Hast Chambers, ESPEC Humidity Chambers, Despatch High Temperature Ovens, B&G Decapsulation equipment, Sonix Scanning Acoustic Microscope, Heller reflow oven, Smart scope 250, Scanning laser view 800, Instron, Cyber scan, CMI X-ray fluorescence, X-ray Fein Focus, UTI A2R4 electrical tester, Buehler cross sectioning equipment, Oscilloscopes.
·Supplied product and reliability engineering with reliability and failure analysis reports utilizing csam images, cross section data and various charts such as curve tracer data. Compile data on failure rate on new materials used for development purposes.
·Provide training on all lab equipment for the development team. Write, update, and maintain training manuals, and specifications for quality and reliability training.
Abpac Inc.
Phoenix, AZ 03/98 – 04/00
Reliability Technician
·Plan and lead the reliability testing of the transfer automold process for BGA, MCM, Passive Components, and Flip Chip packaging process.
·Perform reliability testing of molded BGA packaging for qualification. Qualification included level 1 and level 2 MRT, PCT, TC, HTS, and 85/85 RH.
·Established SPC control charts for reliability process. Support quality department with reports.
·Provide support to product engineering in the development and production of new products.
·Perform audit on quality department to ensure specifications are being met.
·Perform failure analysis using Joel JSM-840 scanning electron microscope equipped with EDAX.
·Familiar with all reliability lab equipment such as Ransco 7207 Temperature Cycling Chamber, Hirayama PC 422R7 Hast Chambers, ESPEC Humidity Chamber, ESPEC High Temperature Ovens, and the JOEL JSM-840 Scanning Electron Microscope, B&G Decapsulation equipment, and the Sonix Scanning Acoustic Microscope.
·Supplied product and reliability engineering with reliability data summary reports utilizing MS Word, Excel, Access, and PowerPoint.
·Provide training on Sonix Scanning Acoustic Microscope for production operators.
·Key member of ISO-9001 Reliability Lab Readiness Team.
Analog Devices
Sunnyvale, CA 02/96 – 09/97
Fab Specialist II
·Process wafers through photolithography department.
·Utilize SPC and TQM techniques to optimize photolithography process.
·Support various engineering groups. Trained new personnel on photolithography equipment.
·Familiar with most photolithography lab equipment such as Ultra Tech Steppers 1100 and 1500, DNS resist coating, Perkin Elmer contact aligner, various microscope inspection equipment, Plasma Therm dry etcher, and various wet etch stations.
·Provide engineering with SPC charts on a weekly basis.
·SPC and TQM team leader.
·Key member of the process control element team for ISO-9001 certification.
Spectra Diode Labs San Jose, CA 09/95 – 02/96
Process Technician
·Process GaAs wafers through photolithography, wet etch, dry etch, thin films, and plating departments.
·Utilize Karl Suss contact aligners for research and development.
·Program and change gases on Plasma Therm dry etcher to modify process for production.
·Stabilize wet etch process using SPC techniques.
·Familiar with all equipment such as Karl Suss aligners, Canon aligners, Hitachi scanning electron microscope, Plasma Therm dry etcher, and various wet etch stations.
Chip Express
Santa Clara, CA 06/91 – 08/95
Engineering Technician
·Clean and cut ASIC devices on laser machine, dry etch, and test ASIC device.
·Provided support to process engineering in the development of a new dry etch process.
·Develop process specifications for Plasma Therm, Laser machinery, and engineering test stations.
Education:
West Valley Community College – Some college coursework completed. Phoenix Training Group· Certification in Emergency Response to Hazardous Material 1996 – 1997.
Skills:
Accomplished Failure Analysis and Reliability Technician with over 16 years experience in the manufacturing and development of semiconductor devices. Familiar with all types of packaging and assembly platforms such as Overmold and Encapsulation BGA, Chip Scale, Flip Chip, QFP, PLCC, SOIC, SMART CARD, Opto, Mems, Vision pack etc,. Specific expertise in the development area of manufacturing that encompasses a complete understanding of the equipment, tooling, process, and SPC controls.
Candidate Contact Information:
| Name: Dave Mundell |
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