technician engineer Resume

Desired Industry: Manufacturing	SpiderID: 17131
Desired Job Location: Boise, Idaho	Date Posted: 11/16/2007
Type of Position: Full-Time Permanent	Availability Date: 3 weeks notice
Desired Wage:
	U.S. Work Authorization: Yes
Job Level: Experienced with over 2 years experience	Willing to Travel: Yes, Less Than 25%
Highest Degree Attained: Other	Willing to Relocate: Yes

Objective:
Objective
To utilize my extensive “Hands-On” skills in an Engineering or Technical position.

Experience:
• Wire Bond Imaging FCIP Process Support Engineer (Micron Technology)
o Major tasks include writing new wire bond programs, monitoring SPC controls, resolving yield issues, performing materials evaluations, performing line conversions and providing Engineering support for Production and Technician personnel.
o Developed procedures for consistent substrate materials evaluations and Wire Bond recipe development, by multiple engineers and their shifts.

• Die Attach Chip on Board (COB) Process Engineer (Micron Technology)
• Qualification of a MST Level 1 capable COB epoxy adhesive.
• Qualification of epoxy dispense processes for the COB and TSOP substrate platforms on the Alphasem and Esec Die Attach systems.
• COB die attach processes development and stacked die process support.

• Wire Bond Process Engineer (Micron Technology)
o Responsible for Wire Bond processes totaling 3.5 million units per week (Flash and DRAM series).
o Utilized JMP SPC software for analysis of capillary and gold wire combinations.
o Developed and wrote a recipe control and management software for Production use.
o Process development with K&S 8028 Wire Bonders (SSB loop, folded loop, 90 micron pitch).

• Calibration Specialist (Micron Technology)
o Development and implementation of a SCADA System to monitor clean room process temperatures, pressures, etc.
o Designed and created a Thermal Mapping System to chart wire bond temperatures in real time. (see patents)
o Inert gas oven research & modification reducing temperature variation and time to setpoint.

• Military Equipment Technician (Micron Technology)
o Calibrated, maintained, and repaired production, environmental, and test equipment used in the Military Assembly group keeping all records required by Mil-Std-45662 and Mil-Std-45208.
o Designed, developed, and wrote the software for a computerized temperature profiling data acquisition system for oven calibrations (please refer to article published)

• Engineering Technician – Nuclear Power Plant
o Conducted computerized testing of a nuclear reactors control rod drive system under Engineering supervision.
o Assumed responsibility for training 3 other Technicians.

Education:
Education
• DEGREE – A.A.S. Electronic Technology Community College of Denver, Denver, CO
• Various courses in
o Technical Writing
o Manufacturing Materials and Processes
o SPC I, SPC II
o Gage Capability
o Design of Experiments
o JMP
o SQL Programming
o Microsoft Access Applications
o Visual Basic
o Electrical Grounding and Shielding
o Autocad
o ME10 2D Drafting and Solid Designer 3D Drawing

Skills:
* Production Process Development/Support in a high volume environment
* Software Development (VB, SQL, Access) for Machine and Process Monitoring
* Technical and Electrical Drawing
* Equipment Installations
* Working Knowledge of Inspection, Test, Measurement, and Calibration Methodologies
* Extensive Instrumentation Experience Involving Temperature, Pressure, Vacuum, Vibration, Flow, and Light Measurement
* SPC/DOE for Material and Equipment Selection

Additional Information:
Patents and Articles
• Semiconductor Wire Bond Machine Lead Frame Thermal Map System Patents
• Non-Conductive and Self-Leveling Lead Frame Clamp Insert For Wire Bonding Integrated Circuits Patent
• I&CS Magazine, “PC Based DAS helps Memory maker profile temperatures”, April 1992

Candidate Contact Information:

This candidate has chosen not to make contact information available on this page.
Click "Contact Candidate" to send this candidate a response.