Ball Grid Array Manufacturing Engineer Job

Employer Name:	SpiderID: 2909882
Location: State College, Pennsylvania	Date Posted: 10/2/2009
Wage: 70-90k/yr	Category: Engineering
Job Code: 3275

Job Description:
Support the development and implementation of process techniques in microelectronic manufacturing operation including specifying, reviewing and revising economic methods, operation sequence and tooling for the fabrication of Ball Grid Arrays (BGA’s), Surface Mount, Die Bond, Wire Bond, Flip Chip assembly, and assembly of multi-chip & monolithic packages (MCP's).

Requirements

*** BS Degree and 4+ years in automated electronic assembly operations.

*** Track record with assembly flow and manufacturing of multi-chip modules,.

*** Ability to conduct Design of Experiments (DOE), statistical process control (SPC), and apply lean methods to cell manufacturing environment.

Join a growing company, working to become the leader in its channel in North America. Enjoy a competitive salary and benefits, individual and company performance bonuses and the opportunity to grow as a key member the team. We are looking for a great person to join the team..

For complete details contact Mr. Borges at:
(609) 584-9000 ext 242

Or submit resume online at:
http://dmc9.com/bxb/app.asp

Or email to:
1000003275_10007253@candseek6.com

Job Requirements:
WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. We will make every effort to consider applications for all available positions and shall use one or more of the contact methods and addresses indicated in resume or online application. Indicated location may be proximate or may be desirable point of embarkation for paid relocation to another venue. CONSIDERED EXPERIENCE INCLUDES: Ball Grid Arrays BGA’s Surface Mount Technology SMT, Die/Wire Bond Wire Bond Die Bond and Flip Chip assembly SPC Lean SMT BGA Manufacturing Process Engineer Printed Circuit Boards Integrated Circuits Semiconductors Ball Grid Array Manufacturing Engineer Production Engineer Automated Electronic Circuit Assembly.Assembly Manufacturing Specifications (AMS), Critical Issue Reports (CIR), Quality Improvement Plans (QIP) and Process Optimization Reports (POR) Manufacturing Engineer Automated PCB Assembly PCBA Manufacturing Engineer North American Job Bank www.najobbank.com

If you submit an application or resume, which contains your email address, we will use that email address to communicate with you about this and other positions. We use an email quality control service to maintain security and a remove and dead address filter. To cancel receiving email communications, simply send an email from your address with the word "remove" in the subject line to pleaseremove@candseek4.com If you have further concern regarding email received from us, call (609) 584-5499. We will be glad to have a real human being contact you upon request.

Job Criteria:
Start Date:
Position Type: Full-Time Permanent
Years of Experience Required: 5
Education Required: Bachelors
Overnight Travel:
Vacation Time:

Job Benefits:
Health/Dental Benefits, Retirement Benefits, Paid Holidays, Vacations, and Sick Leave, Tuition Reimbursement

Contact Information:

Contact Name: Bernard Borges	Company Type: Recruiter
Company: U7 Equipment	Phone: 609-584-9000
Street:	Fax:
City: State College
State: Pennsylvania
Zip:

Web Site: http://dmc9.com/bxb/app.asp