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RF Electronics Packaging Development Group Leader Job
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| Employer Name: |
SpiderID: 2277223 |
| Location: Boston, Massachusetts |
Date Posted: 6/12/2008 |
| Wage: $100,000 to $140,000 |
Category: Engineering |
| Job Code: 1664 |
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| Number Of Openings: 1 |
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Job Description:
Seeking lead engineer with ability to work closely with electrical, mechanical, CAD designers, and manufacturing personnel to develop packaging requirements, lead detailed design efforts, and direct all aspects of the fabrication of leading edge electronic systems.
Packaging experience is desired in RF-Communications, MEMS sensor based systems, printed circuit boards, cabling, and large electromechanical analog/digital systems for military applications with familiarity in various circuit interconnect technologies including MCM-D, MCM-L, and multi-layer laminates for SMT components.
Shall provide technical direction to engineers and technicians as required to complete projects within cost and schedule while identifying and assessing technical, cost, and schedule risks as they occur. Ability to develop and manage cost estimates and project schedules is required.
Contact Philippe Villavicencio at
609-584-9000 x 255
Or apply online at
http://dmc9.com/pyv/app.asp
Or email to:
1000001664_10007230@candseek4.com
Job Criteria:
Start Date: ASAP
Position Type: Full-Time Permanent
Years of Experience Required: 2
Education Required: Bachelors
Overnight Travel:
Vacation Time:
Job Benefits:
Health/Dental Benefits
Contact Information:
| Contact Name: Philippe Villavicencio |
Company Type: Recruiter |
| Company: Diedre Moire Corporation |
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| City: Robbinsville |
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| State: New Jersey |
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| Zip: 08691 |
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Web Site: http://dmc9.com/pyv/app.asp
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